Alumni

Alumni: Students, Post Docs & Visiting Scholars

Sung Joo Park
PhD 2016

Thesis: Managing signal, power, and thermal integrity for three-dimensional integrated circuits and systems (PDF)
Samsung

Kyuhwan Han,
PhD 2015

Thesis: Magneto-dielectric Material Characterization and RF Antenna Design (PDF)
Viasat

Ming Yi
PhD 2015

Thesis: Transient Simulation for Multiscale Chip-Package Structures Using the Laguerre-FDTD Scheme (PDF)
Qualcomm

Satyan Telikepalli
PhD 2014

Thesis: Managing Signal and Power Integrity Using Power Transmission Lines and Alternate Signaling Schemes (PDF)
Qualcomm

Stephen Dumas
MS 2014

Nitish Natu
MS 2013

Thesis: Design and Prototyping of Temperature Resilient Clock Distribution Networks (PDF)
Cypress Semiconductor Corp.

Jianyong Xie
PhD 2013

Thesis: Electrical-Thermal Modeling and Simulation for Three-Dimensional
Integrated Systems (PDF)

Intel Corporation

Jae Young Choi
PhD 2012

Thesis: Modeling and Simulation for Signal and Power Integrity of Electronic Packages (PDF)
Oracle Corporation

Myunghyun Ha
PhD 2011

Thesis: EM Simulation using the Laguerre-FDTD Scheme for Multiscale 3-D Interconnections (PDF)
Intel Corporation

Suzanne Huh
PhD 2011

Thesis: Design of Power Delivery Networks For Noise Suppression and Isolation Using Power Transmission Lines (PDF)
Intel Corporation

Tapobrata Bandyopadhyay
PhD 2011

Thesis: Modeling, Design, and Characterization of Through Vias in silicon and Glass Interposers (PDF)
Texas Instruments

Seunghyun Eddy Hwang
PhD 2011

Thesis: Characterization and Design of Embedded Passive Circuits for Applications up to Millimeter-wave Frequency (PDF)
NVIDIA Corporation

Narayanan T.V.
PhD 2011

Thesis: Fast Methods for Full-wave Electromagnetic Simulations of Integrated Circuit Package Modules (PDF)
Intel Corporation

Nithya Sankaran
PhD 2011

Thesis: Electromagnetic Coupling in Multilayer Thin-flim Organic Packages with Chip-last Embedded Actives (PDF)
NVDIA Corporation

Abhilash Goyal
PhD 2011

Thesis: Methodologies for Low-Cost Testing and Self-Healing of RF Systems (PDF)
Oracle Corporation

Nevin Altunyurt
PhD 2010

Thesis: Integration and Miniaturization of Antennas for System-On-Package Applications (PDF)
Intel Corporation

Ki Jin Han
PhD 2009

Thesis: Electromagnetic Modeling of Interconnections in Three-Dimensional Integration (PDF)
IBM Corporation

Krishna Bharath
PhD 2009

Thesis: Signal and Power Integrity Co-simulation using the Multi-Layer Finite Difference Method (PDF)
Intel Corporation

Aswani Kurra
MS 2009
LSI Corporation

Sukruth G. Pattanagiri
MS 2009
Analog Devices, Inc

Vishal Laddha
MS 2009

Thesis: Correlation of PDN Impedance with Jitter and Voltage Margin in High Speed Channels (PDF)
NVIDIA Corporation

Ranjeeth Doppalapudi
MS 2009

Thesis: Design for manufacturability for system in package applications (PDF)

Janani Chandrasekhar
MS 2008

Thesis: Signal to Power Coupling and Noise Induced Jitter in Differential Signaling (PDF)
NVIDIA Corporation

Krishna Srinivasan
PhD 2008

Thesis: Multiscale EM and Circuit Simulation Using the Laguerre-FDTD Scheme for Package-Aware Integrated-Circuit Design (PDF)
Intel Corporation

Subramanian N Lalgudi
PhD 2008
Thesis: Transient Simulation of Power-Supply Noise in Irregular On-Chip Power Distribution Networks Using Latency Insertion Method, and Causal Transient Simulation of Interconnects Characterized by Band-Limited Data and Terminated by Arbitrary Terminatinos (PDF)
Ansoft Corporation

Tae Hong Kim
PhD 2008
Thesis: Electromagnetic Band Gap (EBG) Synthesis and Its Application in Analog-to-Digital Converter Load (PDF)
IBM Corporation

Wansuk Yun
PhD 2007
Thesis: Design,Modeling, and Characterization of Embedded Passives and interconnects in Inhomogeneous Liquid Crystalline Polymer (LCP) Substrates (PDF)
Broadcom Corporation

Marie-Solange Milleron
MS 2007
Qualcomm

Abdemanaf Tambawala
MS 2007
Cisco Systems

Prathap Muthana
PhD 2007
Thesis: Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors (PDF)
NVIDIA
Corporation

Amit Bavisi
PhD 2006
Thesis: Integrated multi-mode oscillators and filters for multi-band radios using liquid crystalline polymer based packaging technology (PDF)
IBM Corporation

Rohan Mandrekar
PhD 2006
Thesis: Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems (PDF)
IBM Corporation

Jinwoo Choi
PhD 2005
Thesis:
Noise Suppression and Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure (PDF)
IBM Corporation

Bhyrav Mutnury
PhD 2005
Thesis: Macromodeling of Nonlinear Driver and Receiver Circuits (PDF)
IBM Corporation

Vinu Govind
PhD 2005
Thesis: Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates (PDF)
Jacket Micro Devices

Martin Saint-Laurent
PhD 2005
Thesis: Modeling and Analysis of High-Frequency Microprocessor Clocking Networks (PDF)
Intel Corporation

Jifeng Mao
PhD 2004
Thesis: Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using Conformal Mapping, Finite Difference Time Domain and Cavity Resonator Methods (PDF)
Optimal Corp.

Sung Hwan Min
PhD 2004
Thesis:  Automated Construction of Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks (PDF)
Jacket Micro Devices

Woopung Kim
PhD 2004
Thesis: Development of Measurement-based Time-domain Models and its Application to Wafer Level Packaging (PDF)
Texas Instruments

Di Qian
MS 2004
Johns Hopkins University

Erdem Matoglu
PhD 2003
Thesis: Statistical design, analysis, and diagnosis of digital systems and embedded RF circuits (PDF)
IBM Corp

Jinseong Choi
PhD 2002
Thesis: Modeling of Power Supply Noise in Large Chips using the Finite Difference Time Domain Method
(PDF)
Advanced Micro Devices

Joong-Ho Kim
PhD 2002
Thesis:  Modeling of Package and Board Power Distribution Networks Using Transmission Matrix and Macro-modeling Methods
(PDF)
Rambus Corp

Sidharth Dalmia
PhD 2002
Thesis: Design and Implementation of High-Q Passive Devices for Wireless Applications using System-on-Package (SOP) based Organic Methodologies (PDF)
Jacket Micro Devices Inc
.

Sungjun Chun
PhD 2002
Thesis:  Methodologies for Modeling Simultaneous Switching Noise in Multi-Layered Packages and Boards
(PDF)
IBM Corporation

Nanju Na
PhD 2001
Thesis: Modeling and Simulation of Planes in Electronic Packages (PDF)

IBM Corporation

Sreemala Pannala
PhD 1999
Thesis:  Development of Time Domain Characterization Methods for Packaging
Strucutres
(PDF)
Sun Microsystems

Kwang Choi
PhD 1999
Thesis: Modeling and Simulation of Embedded Passives Using Rational Functions in Mult-layered Substrates (PDF)
Intel Corporation

Raj Subramanian
MS 1999
IBM Corporation

Albert Baldisserotto
MS 1999  

Anisha Sood
MS 1999
Raytheon Corporation

Jaya Bandyopadyay
MS 1998
Sun Microsystems

Takayuki Watanabe
 

Mithra Venkatesan

Hideki Sasaki

Suna Choi

Yoshitaka Toyota

Daehyun Chung

Kazuhide Uriu

Hayato Takeuchi

Arvind Agarwal

Dr.P H Rao

Prasad Sankaravel

Venkatesh Chelukkaramdas

V. Venkatesan

K. Suresh

Arijit Majumder

Sulabha Ranade

Ege Engin

Xiaochun Li

Sunghwan Min

Rajaram Sivasubramanian

Youkeun Han

Decao Yang

Junki Min

Sang-Min Han

Antonio Astorino

Akshay Viswanathan

Carmine Gianfanga