Joint University Microelectronics Program (JUMP) Theme 3
In today’s era of big data, cloud computing, and Internet of Things devices, information is produced and shared on a scale that challenges the current processing speeds and energy load demands placed on electronics devices. These challenges are only set to expand, as the ability to create and store data increases in magnitude over the next decade.
With these computing challenges in mind, the Semiconductor Research Corporation's (SRC) Joint University Microelectronics Program (JUMP), which represents a consortium of industrial participants and the Defense Advanced Research Projects Agency (DARPA), has established a new $26 million center called the Applications and Systems-driven Center for Energy-Efficient integrated Nano Technologies (ASCENT). C3PS in partnership with the multidisciplinary, multi-university center will focus on conducting research that aims to increase the performance, efficiency and capabilities of future computing systems for both commercial and defense applications. By going beyond current industry approaches, such as two dimensional scaling and the addition of performance boosters to complementary metal oxide semiconductors, or CMOS technology, the GT team will seek to provide enhanced performance and energy consumption at lower costs.
•University of California, Santa Barbara (UCSB) •Purdue University •University of California, Los Angeles (UCLA) •Stanford University •Cornell University •University of Notredame
•Semiconductor Research Corporation •DARPA •Several member companies