People

Faculty

Center Administrative Staff

Post Doctoral Fellows

Visiting Scholars

Current Students

Min-Yu Huang

Alumni: Students, Post Docs & Visiting Scholars

Graduated Students  (Epsilon Group)

David Zhang
PhD 2016

Thesis: Design of Power Delivery Networks Using Power Transmission Lines for High Speed I/O signaling in Complex Electronic Systems (PDF)
Sandisk

Sung Joo Park
PhD 2016

Thesis: Managing signal, power, and thermal integrity for three-dimensional integrated circuits and systems (PDF)
Samsung

Kyuhwan Han,
PhD 2015

Thesis: Magneto-dielectric Material Characterization and RF Antenna Design (PDF)
Viasat

Ming Yi
PhD 2015

Thesis: Transient Simulation for Multiscale Chip-Package Structures Using the Laguerre-FDTD Scheme (PDF)
Qualcomm

Satyan Telikepalli
PhD 2014

Thesis: Managing Signal and Power Integrity Using Power Transmission Lines and Alternate Signaling Schemes (PDF)
Qualcomm

Stephen Dumas
MS 2014

Nitish Natu
MS 2013

Thesis: Design and Prototyping of Temperature Resilient Clock Distribution Networks (PDF)
Cypress Semiconductor Corp.

Jianyong Xie
PhD 2013

Thesis: Electrical-Thermal Modeling and Simulation for Three-Dimensional
Integrated Systems (PDF)

Intel Corporation

Jae Young Choi
PhD 2012

Thesis: Modeling and Simulation for Signal and Power Integrity of Electronic Packages (PDF)
Oracle Corporation

Myunghyun Ha
PhD 2011

Thesis: EM Simulation using the Laguerre-FDTD Scheme for Multiscale 3-D Interconnections (PDF)
Intel Corporation

Suzanne Huh
PhD 2011

Thesis: Design of Power Delivery Networks For Noise Suppression and Isolation Using Power Transmission Lines (PDF)
Intel Corporation

Tapobrata Bandyopadhyay
PhD 2011

Thesis: Modeling, Design, and Characterization of Through Vias in silicon and Glass Interposers (PDF)
Texas Instruments

Seunghyun Eddy Hwang
PhD 2011

Thesis: Characterization and Design of Embedded Passive Circuits for Applications up to Millimeter-wave Frequency (PDF)
NVIDIA Corporation

Narayanan T.V.
PhD 2011

Thesis: Fast Methods for Full-wave Electromagnetic Simulations of Integrated Circuit Package Modules (PDF)
Intel Corporation

Nithya Sankaran
PhD 2011

Thesis: Electromagnetic Coupling in Multilayer Thin-flim Organic Packages with Chip-last Embedded Actives (PDF)
NVDIA Corporation

Abhilash Goyal
PhD 2011

Thesis: Methodologies for Low-Cost Testing and Self-Healing of RF Systems (PDF)
Oracle Corporation

Nevin Altunyurt
PhD 2010

Thesis: Integration and Miniaturization of Antennas for System-On-Package Applications (PDF)
Intel Corporation

Ki Jin Han
PhD 2009

Thesis: Electromagnetic Modeling of Interconnections in Three-Dimensional Integration (PDF)
IBM Corporation

Krishna Bharath
PhD 2009

Thesis: Signal and Power Integrity Co-simulation using the Multi-Layer Finite Difference Method (PDF)
Intel Corporation

Aswani Kurra
MS 2009
LSI Corporation

Sukruth G. Pattanagiri
MS 2009
Analog Devices, Inc

Vishal Laddha
MS 2009

Thesis: Correlation of PDN Impedance with Jitter and Voltage Margin in High Speed Channels (PDF)
NVIDIA Corporation

Ranjeeth Doppalapudi
MS 2009

Thesis: Design for manufacturability for system in package applications (PDF)

Janani Chandrasekhar
MS 2008

Thesis: Signal to Power Coupling and Noise Induced Jitter in Differential Signaling (PDF)
NVIDIA Corporation

Krishna Srinivasan
PhD 2008

Thesis: Multiscale EM and Circuit Simulation Using the Laguerre-FDTD Scheme for Package-Aware Integrated-Circuit Design (PDF)
Intel Corporation

Subramanian N Lalgudi
PhD 2008
Thesis: Transient Simulation of Power-Supply Noise in Irregular On-Chip Power Distribution Networks Using Latency Insertion Method, and Causal Transient Simulation of Interconnects Characterized by Band-Limited Data and Terminated by Arbitrary Terminatinos (PDF)
Ansoft Corporation

Tae Hong Kim
PhD 2008
Thesis: Electromagnetic Band Gap (EBG) Synthesis and Its Application in Analog-to-Digital Converter Load (PDF)
IBM Corporation

Wansuk Yun
PhD 2007
Thesis: Design,Modeling, and Characterization of Embedded Passives and interconnects in Inhomogeneous Liquid Crystalline Polymer (LCP) Substrates (PDF)
Broadcom Corporation

Marie-Solange Milleron
MS 2007
Qualcomm

Abdemanaf Tambawala
MS 2007
Cisco Systems

Prathap Muthana
PhD 2007
Thesis: Design of High Speed Packages and Boards Using Embedded Decoupling Capacitors (PDF)
NVIDIA
Corporation

Amit Bavisi
PhD 2006
Thesis: Integrated multi-mode oscillators and filters for multi-band radios using liquid crystalline polymer based packaging technology (PDF)
IBM Corporation

Rohan Mandrekar
PhD 2006
Thesis: Modeling and Co-simulation of Signal Distribution and Power Delivery in Packaged Digital Systems (PDF)
IBM Corporation

Jinwoo Choi
PhD 2005
Thesis:
Noise Suppression and Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure (PDF)
IBM Corporation

Bhyrav Mutnury
PhD 2005
Thesis: Macromodeling of Nonlinear Driver and Receiver Circuits (PDF)
IBM Corporation

Vinu Govind
PhD 2005
Thesis: Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates (PDF)
Jacket Micro Devices

Martin Saint-Laurent
PhD 2005
Thesis: Modeling and Analysis of High-Frequency Microprocessor Clocking Networks (PDF)
Intel Corporation

Jifeng Mao
PhD 2004
Thesis: Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using Conformal Mapping, Finite Difference Time Domain and Cavity Resonator Methods (PDF)
Optimal Corp.

Sung Hwan Min
PhD 2004
Thesis:  Automated Construction of Macromodels from Frequency Data for Simulation of Distributed Interconnect Networks (PDF)
Jacket Micro Devices

Woopung Kim
PhD 2004
Thesis: Development of Measurement-based Time-domain Models and its Application to Wafer Level Packaging (PDF)
Texas Instruments

Raghavan Madhavan
MS 2004
Qualcomm

Di Qian
MS 2004
Johns Hopkins University

Erdem Matoglu
PhD 2003
Thesis: Statistical design, analysis, and diagnosis of digital systems and embedded RF circuits (PDF)
IBM Corp

Jinseong Choi
PhD 2002
Thesis: Modeling of Power Supply Noise in Large Chips using the Finite Difference Time Domain Method
(PDF)
Advanced Micro Devices

Joong-Ho Kim
PhD 2002
Thesis:  Modeling of Package and Board Power Distribution Networks Using Transmission Matrix and Macro-modeling Methods
(PDF)
Rambus Corp

Sidharth Dalmia
PhD 2002
Thesis: Design and Implementation of High-Q Passive Devices for Wireless Applications using System-on-Package (SOP) based Organic Methodologies (PDF)
Jacket Micro Devices Inc
.

Sungjun Chun
PhD 2002
Thesis:  Methodologies for Modeling Simultaneous Switching Noise in Multi-Layered Packages and Boards
(PDF)
IBM Corporation

Nanju Na
PhD 2001
Thesis: Modeling and Simulation of Planes in Electronic Packages (PDF)

IBM Corporation

Sreemala Pannala
PhD 1999
Thesis:  Development of Time Domain Characterization Methods for Packaging
Strucutres
(PDF)
Sun Microsystems

Kwang Choi
PhD 1999
Thesis: Modeling and Simulation of Embedded Passives Using Rational Functions in Mult-layered Substrates (PDF)
Intel Corporation

Raj Subramanian
MS 1999
IBM Corporation

Albert Baldisserotto
MS 1999  

Anisha Sood
MS 1999
Raytheon Corporation

Jaya Bandyopadyay
MS 1998
Sun Microsystems