Recent Publications and Patents

Recent Publications

Amaravati, A.; Chugh, M.; Raychowdhury, A., "A time interleaved DAC sharing SAR Pipeline ADC for ultra-low power camera front ends," in Very Large Scale Integration (VLSI-SoC), 2015 IFIP/IEEE International Conference on, pp.231-236, 5-7 Oct. 2015, doi: 10.1109/VLSI-SoC.2015.7314421

Arghode, V.K.; Joshi, Y., "Evaluation of modified body force (MBF) model for rapid air flow modeling through perforated tiles," in Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st, pp.127-137, 15-19 March 2015 doi:10.1109/SEMI-THERM.2015.7100151

Arghode, V.K.; Kang, Taegyu; Joshi, Y.; Phelps, W.; Michaels, M., "Anemometric tool for air flow rate measurement through perforated tiles in a raised floor data center," in Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st, pp.163-17,15-19 March 2015

Bin Nasir, S.; Gangopadhyay, S.; Raychowdhury, A., "5.6 A 0.13μm fully digital low-dropout regulator with adaptive control and reduced dynamic stability for ultra-wide dynamic range," in Solid- State Circuits Conference - (ISSCC), 2015 IEEE International, pp.1-3, 22-26 Feb. 2015, doi:10.1109/ISSCC.2015.7062944

Bin Nasir, S.; Raychowdhury, A., "On limit cycle oscillations in discrete-time digital linear regulators," in Applied Power Electronics Conference and Exposition (APEC), 2015 IEEE, pp.371-376, 15-19 March 2015, doi:10.1109/APEC.2015.7104377

Chen, Qiao; Liu, Xi; Sundaram, V.; Sitaraman, S.K.; Tummala, R.R., "Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications," in Device and Materials Reliability, IEEE Transactions on, vol.14, no.4, pp.1041-1048, Dec. 2014, doi:10.1109/TDMR.2014.2361125

Chen, Wei; Sitaraman, S.K., "Response Surface and Multiobjective Optimization Methodology for the Design of Compliant Interconnects," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol.4, no.11, pp.1769-1777, Nov. 2014, doi:10.1109/TCPMT.2014.2357762

Chi, Taiyun; Luo, Jun; Hu, Song; Hua Wang, "A Multi-Phase Sub-Harmonic Injection Locking Technique for Bandwidth Extension in Silicon-Based THz Signal Generation," in Solid-State Circuits, IEEE Journal of, vol. 50, no. 8, pp.1861-1873, Aug. 2015, doi:10.1109/JSSC.2015.2422074

Chi, Taiyun; Papapolymerou, J.; Hua Wang, "A +2.3dBm 124–158GHz Class-C frequency quadrupler with folded-transformer based multi-phase driving," in Radio Frequency Integrated Circuits Symposium (RFIC), 2015 IEEE, pp.263-266, 17-19 May 2015, doi:10.1109/RFIC.2015.7337755

Cho, Sangbeom; Sundaram, V.; Tummala, R.R.; Joshi, Y.K., "Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 8, pp.1075-1084, Aug. 2015
doi:10.1109/TCPMT.2015.2450731

Gangopadhyay, S.; Bin Nasir, S.; Raychowdhury, A., "Integrated power management in IoT devices under wide dynamic ranges of operation," in Design Automation Conference (DAC), 2015 52nd ACM/EDAC/IEEE, pp.1-6, 8-12 June 2015, doi: 10.1145/2744769.2747931

Goyal, A.; Swaminathan, M.; Chatterjee, A., "One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 3, no. 2, pp.236-246, Feb. 2013,
doi:10.1109/TCPMT.2012.2226582

Han, K.; Swaminathan, M.; Pulugurtha, R.; Sharma, H.; Tummala, R.; Yang, S.; Nair, V., "Magneto-dielectric Nanocomposite for Antenna Miniaturization and SAR reduction," in Antennas and Wireless Propagation Letters, IEEE, vol. PP, no. 99, pp.1-1, doi: 10.1109/LAWP.2015.2430284

Han, K.; Swaminathan, M.; Pulugurtha, R.; Sharma, H.; Tummala, R.; Rawlings, B.M.; Nair, V., "RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 12, pp.1850-1859, Dec. 2015, doi: 10.1109/TCPMT.2015.2465383

Han, Kyu; Swaminathan, M.; Raj, P.M.; Sharma, H.; Tummala, R.; Rawlings, B.; Yang, S.; Nair, V., "Synthesis of magneto-dielectrics from first principles and antenna design," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.2228-2234, 26-29 May 2015, doi: 10.1109/ECTC.2015.7159913

Han, Ki Jin; Sandeep, Srikumar; Martin, Bill; Swaminathan, Madhavan, "Modeling of Power Distribution Networks for path finding," in Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th, pp.11-14, 25-28 Oct. 2015, doi:10.1109/EPEPS.2015.7347119

Hu, Song; Kousai, S.; Park, Jong Seok; Chlieh, O.L.; Hua Wang, "Design of A Transformer-Based Reconfigurable Digital Polar Doherty Power Amplifier Fully Integrated in Bulk CMOS," in Solid-State Circuits, IEEE Journal of, vol. 50, no. 5, pp.1094-1106, May 2015, doi:10.1109/JSSC.2015.2415494

Hu, Song; Kousai, S.; Hua Wang, "Antenna Impedance Variation Compensation by Exploiting a Digital Doherty Power Amplifier Architecture," in Microwave Theory and Techniques, IEEE Transactions on, vol. 63, no. 2, pp.580-597, Feb. 2015, doi:10.1109/TMTT.2014.2385860

Huh, S.L.; Swaminathan, M.; Keezer, D., "Pseudo-balanced Signaling Using Power Transmission Lines for Parallel I/O Links," Electromagnetic Compatibility, IEEE Transactions on, vol. 55, no. 2, pp.315-327, April 2013, doi:10.1109/TEMC.2012.2220854

Kwatra, A.; Samet, D.; Sitaraman, S.K., "Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.1531-1537, 26-29 May 2015, doi:10.1109/ECTC.2015.7159801

Ki, Jin Han; Swaminathan, M.; Jongwoo Jeong, "Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 1, pp.108-118, Jan. 2015, doi: 10.1109/TCPMT.2014.2372771

Kim, D.; Mukhopadhyay, S., "Partitioning Methods for Interface Circuit of Heterogeneous 3-D-ICs Under Process Variation," in Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, vol. PP, no. 99, pp.1-10, doi: 10.1109/TVLSI.2015.2477779

Kim, Jin Han; Swaminathan, M.; JongWoo Jeong, "Modeling of Through-Silicon Via (TSV) Interposer Considering Depletion Capacitance and Substrate Layer Thickness Effects," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 1, pp.108-118, Jan. 2015, doi: 10.1109/TCPMT.2014.2372771

Kim, Min Suk ; Cho, Sangbeom; Min, Junki; Pulugurtha, M.R.; Huang, N.; Sitaraman, S.; Sundaram, V.; Velez, M.; Ravindran, A.; Joshi, Y.; Tummala, R., "Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.1163-1167, 26-29 May 2015, doi: 10.1109/ECTC.2015.7159742

Ko, Jong Hwan; Mudassar, B.A.; Mukhopadhyay, S., "An Energy-Efficient Wireless Video Sensor Node for Moving Object Surveillance," in Multi-Scale Computing Systems, IEEE Transactions on, vol. 1, no. 1, pp.7-18, March 1 2015, doi:10.1109/TMSCS.2015.2478469

Kumar, V.; Sharma, R.; Uzunlar, E.; Li Zheng; Bashirullah, R.; Kohl, P.; Bakir, M.S.; Naeemi, A., "Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 4, no. 8, pp.1335-1346, Aug. 2014, doi:10.1109/TCPMT.2014.2326798

Kung, Jaeha; Kim, Duckhwan; Mukhopadhyay, S., "On the Impact of Energy-Accuracy Tradeoff in a Digital Cellular Neural Network for Image Processing," in Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, vol. 34, no. 7, pp.1070-1081, July 2015,
doi:10.1109/TCAD.2015.2406853

Kung, Jaeha; Yueh, Wen; Yalamanchili, S.; Mukhopadhyay, S., "Post-Silicon Estimation of Spatiotemporal Temperature Variations Using MIMO Thermal Filters," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 5, pp.650-660, May 2015,
doi:10.1109/TCPMT.2015.2417113

Li, Tso-Wei; Hua Wang, "A millimeter-wave fully differential transformer-based passive reflective-type phase shifter," in Custom Integrated Circuits Conference (CICC), 2015 IEEE, pp.1-4, 28-30 Sept. 2015, doi:10.1109/CICC.2015.7338423

Li, Tso-Wei; Park, Jong Seok; Hua Wang, "A 2–24GHz 360° full-span differential vector modulator phase rotator with transformer-based poly-phase quadrature network," in Custom Integrated Circuits Conference (CICC), 2015 IEEE, pp.1-4, 28-30 Sept. 2015, doi:10.1109/CICC.2015.7338421

Li, Zhuo; Zhang, Rongwei; Liu, Yan; Le, Taoran; Wong, C.P., "Highly conductive, flexible, bio-compatible poly-urethane based isotropic conductive adhesives for flexible electronics," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.406-411, May 29 2012-June 1 2012, doi: 10.1109/ECTC.2012.6248862

Liang, Qizhen; Moon, Kyoung-sik; Jiang, Hongjin; Wong, C.C., "Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 2, no. 10, pp.1571-1579, Oct. 2012, doi: 10.1109/TCPMT.2012.2204885

Lin, Ziyin; Lau, Shunyi; Moon, Kyoung-sik; Wong, C.P., "Polyhedral oligomeric silsesquioxanes (POSS)-filled underfill with excellent high temperature performance," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.1599-1604, May 29 2012-June 1 2012, doi: 10.1109/ECTC.2012.6249050

Lin, Ziyin; Yao, Yagang; McNamara, A.; Moon, Kyoung-sik; Wong, C.P., "Single/few-layer boron nitride-based nanocomposites for high thermal conductivity underfills," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.1437-1441, May 29 2012-June 1 2012, doi: 10.1109/ECTC.2012.6249025

Liu, Xi; Li, Ming; Mullen, D.R.; Cline, J.; Sitaraman, S.K., "Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring," in Device and Materials Reliability, IEEE Transactions on, vol. 14, no. 1, pp.512-522, March 2014, doi:10.1109/TDMR.2013.2283062

Liu, Yan; Lin, Ziyin; Moon, Kyoung-sik; Wong, C.P., "Robust, novel, and low cost superhydrophobic nanocomposites coating for reliability improvement of microelectronics," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.2135-2139, May 29 2012-June 1 2012, doi:10.1109/ECTC.2012.6249137

Liu, Yan; Lin, Ziyin; Zhao, Xueying ; Yoo, Sehoon; Moon, Kyoung-sik; Wong, C.P., "ZnO quantum dots-filled encapsulant for LED packaging," in Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, pp.2140-2144, May 29 2012-June 1 2012, doi:10.1109/ECTC.2012.6249138

McCann, S.; Sato, Y.; Sundaram, V.; Tummala, R.R.; Sitaraman, S.K., "Prevention of Cracking from RDL Stress and Dicing Defects in Glass Substrates," in Device and Materials Reliability, IEEE Transactions on, vol. PP, no. 99, pp.1-1, doi:10.1109/TDMR.2015.2507978

McCann, S.R.; Sato, Y.; Sundaram, V.; Tummala, R.R.; Sitaraman, S.K., "Study of cracking of thin glass interposers intended for microelectronic packaging substrates," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.1938-1944, 26-29 May 2015, doi:10.1109/ECTC.2015.7159866

McCann, S.R.; Sundaram, V.; Tummala, R.R.; Sitaraman, S.K., "Flip-chip on glass (FCOG) package for low warpage," in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, pp.2189-2193, 27-30 May 2014, doi:10.1109/ECTC.2014.6897606

Muller, Sebastian; Swaminathan, Madhavan, "2D-FDFD with integrated via model for accurate simulation of PCBs and packages," in Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th, pp.123-126, 25-28 Oct. 2015, doi:10.1109/EPEPS.2015.7347144

Oh, Hanju; May, G.S.; Bakir, M.S., "Silicon interposer platform with low-loss through-silicon vias using air," in 3D Systems Integration Conference (3DIC), 2015 International, pp.TS11.3.1-TS11.3.4, Aug. 31 2015-Sept. 2 2015, doi: 10.1109/3DIC.2015.7334621

Pardue, C.; Swaminathan, M.; Balaguru, J.B., "Lossy frequency selective surfaces for gas sensing using ZnO films," in Nanoscale Architectures (NANOARCH), 2015 IEEE/ACM International Symposium on, pp.19-20, 8-10 July 2015, doi:10.1109/NANOARCH.2015.7180578

Park, Jong Seok; Chi, Taiyun; Butts, J.; Hookway, T.; McDevitt, T.; Hua Wang, "11.7 A multimodality CMOS sensor array for cell-based assay and drug screening," in Solid- State Circuits Conference - (ISSCC), 2015 IEEE International, pp.1-3, 22-26 Feb. 2015, doi:10.1109/ISSCC.2015.7062999

Park, Jong Seok; Hu, Song; Wang, Yanjie; Hua Wang "A highly linear dual-band mixed-mode polar power amplifier in CMOS with an ultra-compact output network," in Custom Integrated Circuits Conference (CICC), 2015 IEEE, pp.1-4, 28-30 Sept. 2015, doi:10.1109/CICC.2015.7338362

Park, Sung Joo; Natu, N.; Swaminathan, M., "Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 11, pp.1669-1678, Nov. 2015, doi:10.1109/TCPMT.2015.2482947

Park, Sung Joo; Swaminathan, M., "Temperature-aware power distribution network designs for 3D ICs and systems," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.732-737, 26-29 May 2015, doi:10.1109/ECTC.2015.7159672

Raghavan, S.; Schmadlak, I.; Leal, G.; Sitaraman, S.K., "Framework to extract cohesive zone parameters using double cantilever beam and four-point bend fracture tests," in Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on, pp.1-5, 7-9 April 2014, doi:10.1109/EuroSimE.2014.6813806

Raghavan, S.; Schmadlak, I.; Leal, G.; Sitaraman, S.K., "Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation," in Device and Materials Reliability, IEEE Transactions on, vol. 14, no. 1, pp.57-65, March 2014, doi:10.1109/TDMR.2013.2288255

Sahu, V.; Joshi, Y.K.; Fedorov, A.G.; Je-Hyeong Bahk; Xi Wang; Shakouri, A., "Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 1, pp.57-64, Jan. 2015, doi: 10.1109/TCPMT.2014.2332516

Sarvey, T.E.; Yang Zhang; Li Zheng; Thadesar, P.; Gutala, R.; Cheung, C.; Rahman, A.; Bakir, M.S., "Embedded cooling technologies for densely integrated electronic systems," in Custom Integrated Circuits Conference (CICC), 2015 IEEE, pp.1-8, 28-30 Sept. 2015, doi:10.1109/CICC.2015.7338365

Singh, A.; Kar, M.; Ko, J.H.; Mukhopadhyay, S., "Exploring power attack protection of resource constrained encryption engines using integrated low-drop-out regulators," in Low Power Electronics and Design (ISLPED), 2015 IEEE/ACM International Symposium on, pp.134-139, 22-24 July 2015, doi: 10.1109/ISLPED.2015.7273503

Song, W.; Mukhopadhyay, S.; Yalamanchili, S., "Architectural Reliability: Lifetime Reliability Characterization and Management ofMany-Core Processors," in Computer Architecture Letters, vol. 14, no. 2, pp.103-106, July-Dec. 1 2015, doi: 10.1109/LCA.2014.2340873

Song, W.J.; Mukhopadhyay, S.; Yalamanchili, S., "KitFox: Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 11, pp.1590-1601, Nov. 2015, doi: 10.1109/TCPMT.2015.2485158

Song, W.J.; Mukhopadhyay, S.; Yalamanchili, S., "Managing performance-reliability tradeoffs in multicore processors," in Reliability Physics Symposium (IRPS), 2015 IEEE International, pp.3C.1.1-3C.1.7, 19-23 April 2015, doi: 10.1109/IRPS.2015.7112707

Thadesar, P.A.; Bakir, M.S., "Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.281-286, 26-29 May 2015, doi:10.1109/ECTC.2015.7159605

Telikepalli, S.; Swaminathan, M.; Keezer, D., "A Simple Technique for Power Distribution With Better Characteristics Than Electromagnetic Bandgap Structures," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 6, pp.797-805, June 2015, doi:10.1109/TCPMT.2015.2432837

Trivedi, A.R.; Ahmed, K.Z.; Mukhopadhyay, S., "Negative Gate Transconductance in Gate/Source Overlapped Heterojunction Tunnel FET and Application to Single Transistor Phase Encoder," in Electron Device Letters, IEEE, vol. 36, no. 2, pp.201-203, Feb. 2015, doi:10.1109/LED.2015.2388533

Wei, Yun ; Ji, Chuanyi; Galvan, F.; Couvillon, S.; Orellana, G.; Momoh, J., "Learning Geotemporal Nonstationary Failure and Recovery of Power Distribution," in Neural Networks and Learning Systems, IEEE Transactions on, vol. 25, no. 1, pp.229-240, Jan. 2014, doi:10.1109/TNNLS.2013.2271853

Woodrum, D.C.; Sarvey, T.; Bakir, M.S.; Sitaraman, S.K., "Reliability study of micro-pin fin array for on-chip cooling," in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp.2283-2287, 26-29 May 2015, doi:10.1109/ECTC.2015.7159922

Xiao, H.; Yueh, W.; Mukhopadhyay, S.; Yalamanchili, S., "Thermally Adaptive Cache Access Mechanisms for 3D Many-core Architectures," in Computer Architecture Letters, vol. PP, no. 99, pp.1-1, doi:10.1109/LCA.2015.2495125

Xie, Biancun; Swaminathan, M.; Ki Jin Han, "FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer," in Electromagnetic Compatibility, IEEE Transactions on, vol. 57, no. 3, pp.496-504, June 2015, doi:10.1109/TEMC.2015.2405014

Yi, Ming; Swaminathan, M., "Transient non-conformal domain decomposition using the Laguerre-FDTD method," in Computational Electromagnetics (ICCEM), 2015 IEEE International Conference on, pp.327-329, 2-5 Feb. 2015, doi: 10.1109/COMPEM.2015.7052650

Yi, Ming; Zhiguo Qian; Aydiner, A.; Swaminathan, M., "Transient Simulation of Multiscale Structures Using the Nonconformal Domain Decomposition Laguerre-FDTD Method," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 4, pp.532-540, April 2015, doi:10.1109/TCPMT.2015.2411744

Zhang, D.C.; Swaminathan, M.; Keezer, D., "Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 6, pp.806-817, June 2015, doi:10.1109/TCPMT.2015.2431191

Zhang, David C.; Swaminathan, Madhavan; Keezer, David, "Reduction of PDN induced coupling into signal lines using PTL power distribution," in Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th, pp.117-120, 25-28 Oct. 2015, doi:10.1109/EPEPS.2015.7347143

Zheng, Li; Zhang, Yang; Bakir, M.S., "A Silicon Interposer Platform Utilizing Microfluidic Cooling for High-Performance Computing Systems," in Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 5, no. 10, pp.1379-1386, Oct. 2015, doi:10.1109/TCPMT.2015.2470544

Zia, Muneeb; Zhang, Chaoqi; Thadesar, Paragkumar; Hookway, Tracy; Chi, Taiyun; Gonzalez, Joe; McDevitt, Todd; Wang, Hua; Bakir, Muhannad S., "Fabrication of and cell growth on silicon membranes with high density TSVs for bio-sensing applications," in Biomedical Circuits and Systems Conference (BioCAS), 2015 IEEE, pp.1-4, 22-24 Oct. 2015, doi: 10.1109/BioCAS.2015.7348428