SRC Design

  • System on package integration of antennas
  • Low cost testing methodology
  • Self-healing RF components design
  • Magnetic substrate characterization

PDES Program

  • Electrical-thermal co-simulation
  • IC package/interconnects characterization
  • Through-Silicon Vias simulation
  • 3D multi-scale chip-package simulation
  • EBG modeling and synthesis
  • Modeling of coupling in 3D integration

CAMEL Program

  • Advanced PTL signaling
  • DC Analysis in 3D PDN
  • Classical SI/PI
  • High speed I/O signaling